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聚二硫二丙烷磺酸钠在二元络合化学镀铜体系中的作用

卢建红 焦汉东 焦树强

卢建红, 焦汉东, 焦树强. 聚二硫二丙烷磺酸钠在二元络合化学镀铜体系中的作用[J]. 工程科学学报, 2017, 39(9): 1380-1385. doi: 10.13374/j.issn2095-9389.2017.09.011
引用本文: 卢建红, 焦汉东, 焦树强. 聚二硫二丙烷磺酸钠在二元络合化学镀铜体系中的作用[J]. 工程科学学报, 2017, 39(9): 1380-1385. doi: 10.13374/j.issn2095-9389.2017.09.011
LU Jian-hong, JIAO Han-dong, JIAO Shu-qiang. Effect of sodium 3,3'-dithiodipropane sulfonate in a dual-ligand electroless copper system[J]. Chinese Journal of Engineering, 2017, 39(9): 1380-1385. doi: 10.13374/j.issn2095-9389.2017.09.011
Citation: LU Jian-hong, JIAO Han-dong, JIAO Shu-qiang. Effect of sodium 3,3'-dithiodipropane sulfonate in a dual-ligand electroless copper system[J]. Chinese Journal of Engineering, 2017, 39(9): 1380-1385. doi: 10.13374/j.issn2095-9389.2017.09.011

聚二硫二丙烷磺酸钠在二元络合化学镀铜体系中的作用

doi: 10.13374/j.issn2095-9389.2017.09.011
详细信息
  • 中图分类号: TQ153.1

Effect of sodium 3,3'-dithiodipropane sulfonate in a dual-ligand electroless copper system

  • 摘要: 用电化学方法研究添加剂聚二硫二丙烷磺酸钠(SPS)对乙二胺四乙酸(EDTA)/四羟丙基乙二胺(THPED)二元络合化学镀铜过程的影响,测量体系的混合电位-时间关系,加入SPS后混合电位负移,负移过程较平缓,无突跃现象;采用线性扫描伏安法研究体系,表明SPS促进了阴阳两极的极化,但主要是影响甲醛氧化的阳极极化过程.SPS也因此一定程度上提高了过程的沉积速率.通过扫描电镜、能谱仪和X射线衍射仪对结构的分析,镀层铜纯净度较高,无氧化铜等夹杂,镀层细致平滑,发现SPS有促进(200)晶面择优取向的作用.
  • [1] Narcus H. Practical copper reduction on nonconductor. Metal Finish, 1947, 45(2):964
    [2] Cahill A E. Surface catalyzed reduction of copper. Am Electrochem Soc Proc, 1957, 44:130
    [7] Shingubara S, Wang Z L, Yaegashi O, et al. Bottom-up fill of copper in deep submicrometer holes by electroless plating. Electrochem Solid-State Lett, 2004, 7(6):C78
    [8] Miura S, Honma H. Advancecd copper electroplating for application of electronics. Surf Coat Technol, 2003, 169-170:91
    [9] Kobayashi T, Kawasaki J, Mihara K, et al. Via-filling using electroplating for build-up PCBs. Electrochim Acta, 2001, 47(1-2):85
    [11] Norkus E, Vaškelis A, Jačiauskienė J, et al. Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths:application of xylitol, D-mannitol and D-sorbitol as copper (Ⅱ) ligands. J Appl Electrochem, 2005, 35(1):41
    [12] Mishra K G, Paramguru R K. Kinetics and mechanism of electroless copper deposition at moderate-to-high copper ion and lowto-moderate formaldehyde concentrations. Metall Mater Trans B, 1999, 30(2):223
    [13] Lee C H, Lee S C, Kim J J. Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropy1)-disulfide (SPS). Electrochim Acta, 2005, 50(16-17):3563
    [14] Paunovic M. Ligand effects in electroless copper deposition. J Electrochem Soc, 1977, 124(3):349
    [15] Norkus E, Kepenienė V, Vaškelis A, et al. Application of environmentally friendly ligands for alkaline electroless copper plating systems:electroless copper deposition using trisodium salt of 2-hydroxy-1, 2, 3-propanetricarboxylic acid as Cu (Ⅱ) ligand. Chemija, 2006, 17(4):20
    [16] Ramasubramanian M, Popov B N, White R E, et al. A mathematical model for electroless copper deposition on planar substrates. J Electrochem Soc, 1999, 146(1):111
    [17] Pauliukaité R, Stalnionis G, Jusys Z, et al. Effect of Cu (Ⅱ) ligands on electroless copper deposition rate in formaldehyde solutions:An EQCM study. J Appl Electrochem, 2006, 36(11):1261
    [18] Jusys Z, Pauliukaite R, Vaškelis A. EQCM study of the effect of ligands on the rate of CuⅡ reduction by formaldehyde. Phys Chem Chem Phys, 1999, 1:313
    [19] Vaškelis A, Jačiauskienė J, Stalnionienė I, et al. Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions. J Electroanal Chem, 2007, 600(1):6
    [20] Jusys Z, Stalnionis G, Juzeliūnas E, et al. The kinetic HD isotope effect in electroless copper plating. An EQCM study. Electrochim Acta, 1998, 43(3-4):301
    [21] Mishra K G, Paramguru R K. Surface modification with copper by electroless deposition technique:an overview. Afr J Pure Appl Chem, 2010, 4(6):87
    [22] Hu F T, Yang S, Wang H Z, et al. Electroless silver coating on copper microcones for low-temperature solid-state bonding. J Electron Mater, 2015, 44(11):4516
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  • 收稿日期:  2016-12-01

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