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单晶硅脆塑转变临界厚度的原位实验

刘冰 徐宗伟 李蕊 何忠杜

刘冰, 徐宗伟, 李蕊, 何忠杜. 单晶硅脆塑转变临界厚度的原位实验[J]. 工程科学学报, 2019, 41(3): 343-349. doi: 10.13374/j.issn2095-9389.2019.03.007
引用本文: 刘冰, 徐宗伟, 李蕊, 何忠杜. 单晶硅脆塑转变临界厚度的原位实验[J]. 工程科学学报, 2019, 41(3): 343-349. doi: 10.13374/j.issn2095-9389.2019.03.007
LIU Bing, XU Zong-wei, LI Rui, HE Zong-du. In-situ experiment on critical thickness of brittle-ductile transition of single-crystal silicon[J]. Chinese Journal of Engineering, 2019, 41(3): 343-349. doi: 10.13374/j.issn2095-9389.2019.03.007
Citation: LIU Bing, XU Zong-wei, LI Rui, HE Zong-du. In-situ experiment on critical thickness of brittle-ductile transition of single-crystal silicon[J]. Chinese Journal of Engineering, 2019, 41(3): 343-349. doi: 10.13374/j.issn2095-9389.2019.03.007

单晶硅脆塑转变临界厚度的原位实验

doi: 10.13374/j.issn2095-9389.2019.03.007
基金项目: 

天津市自然科学基金资助项目(18JCQNJC75400,17JCZDJC38200)

国家自然科学基金资助项目(51805371)

详细信息
  • 中图分类号: TP122;TH69;TH162+.1

In-situ experiment on critical thickness of brittle-ductile transition of single-crystal silicon

  • 摘要: 为提高单晶硅纳米切削表面质量的同时,不影响加工效率,以扫描电子显微镜高分辨在线观测技术为手段,在真空环境下开展了单晶硅原位纳米切削实验研究.首先,利用聚焦离子束对单晶硅材料进行样品制备,并对金刚石刀具进行纳米级刃口的可控修锐.然后,利用扫描电子显微镜实时观察裂纹的萌生与扩展,分析了单晶硅纳米切削脆性去除行为.最后,分别采用刃口半径为40、50和60 nm的金刚石刀具研究了晶体取向和刃口半径对单晶硅脆塑转变临界厚度的影响.实验结果表明:在所研究的晶体取向范围内,在(111)晶面上沿[111]晶向进行切削时,单晶硅最容易以塑性模式被去除,脆塑转变临界厚度约为80 nm.此外,刀具刃口半径越小,单晶硅在纳米切削过程中越容易发生脆性断裂,当刀具刃口半径为40 nm时,脆塑转变临界厚度约为40 nm.然而刀具刃口半径减小的同时,已加工表面质量有所提高,即刀具越锋利越容易获得表面质量高的塑性表面.
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出版历程
  • 收稿日期:  2018-02-24

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