X-Ray Diffraction Study of the Interface Layer of Low Temperature Deposited Diamond Films
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Abstract
The constituent and the structure of the interface layer between the low temperature deposited diamond films and the single crystal silicon substrate was studed by X-ray diffraction (including small angle diffraction) technique. It was found that the interface layer for diamond film deposited at 700℃ was α-SiC. At lower temperature range (580-290)℃, the interface layer was composed of α-SiC and SiO2. Crystal structure of α-SiC and SiO2, and the d-spacings of the diamond films were discussed.
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