龚一波, 黄典冰, 杨天钧. 烧结料层温度分布模型解析解及其统一形式[J]. 工程科学学报, 2002, 24(4): 395-399. DOI: 10.13374/j.issn1001-053x.2002.04.003
引用本文: 龚一波, 黄典冰, 杨天钧. 烧结料层温度分布模型解析解及其统一形式[J]. 工程科学学报, 2002, 24(4): 395-399. DOI: 10.13374/j.issn1001-053x.2002.04.003
GONG Yibo, HUANG Dianbing, YANG Tianjun. Temperature Field Model of the Sinter Bed and Its Common Analytical Solution[J]. Chinese Journal of Engineering, 2002, 24(4): 395-399. DOI: 10.13374/j.issn1001-053x.2002.04.003
Citation: GONG Yibo, HUANG Dianbing, YANG Tianjun. Temperature Field Model of the Sinter Bed and Its Common Analytical Solution[J]. Chinese Journal of Engineering, 2002, 24(4): 395-399. DOI: 10.13374/j.issn1001-053x.2002.04.003

烧结料层温度分布模型解析解及其统一形式

Temperature Field Model of the Sinter Bed and Its Common Analytical Solution

  • 摘要: 以烧结理论为基础,建立了一个简易可行的烧结料层温度分布模型.根据料层各带特点,对模型进行简化,求出了解析解.对各带的解析解做分析,提出了垂直传热距离指数和水平传热距离指数的概念,以统一的形式给出各带的解析解.

     

    Abstract: Though many temperature field models of the sinter bed have been created, it is difficult to obtain the analytical or numerical solution of such model. Based on the sinter theory, a temperature field model has been founded. Then the model was simplified and the analytical solutions were obtained for respective four band in the sinter bed. Vertical conduction distance index and horizontal conduction distance index were defined and a common format was formulated based on these solutions.

     

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