贾瑞灵, 吴承斌, 严川伟, 王福会. Cl-对镁-铝合金β相模型合金表面膜稳定性的影响[J]. 工程科学学报, 2010, 32(4): 466-471. DOI: 10.13374/j.issn1001-053x.2010.04.010
引用本文: 贾瑞灵, 吴承斌, 严川伟, 王福会. Cl-对镁-铝合金β相模型合金表面膜稳定性的影响[J]. 工程科学学报, 2010, 32(4): 466-471. DOI: 10.13374/j.issn1001-053x.2010.04.010
JIA Rui-ling, WU Cheng-bin, YAN Chuan-wei, WANG Fu-hui. Influence of Cl- on the stability of surface films on the β phase model alloy of magnesium-aluminum alloys[J]. Chinese Journal of Engineering, 2010, 32(4): 466-471. DOI: 10.13374/j.issn1001-053x.2010.04.010
Citation: JIA Rui-ling, WU Cheng-bin, YAN Chuan-wei, WANG Fu-hui. Influence of Cl- on the stability of surface films on the β phase model alloy of magnesium-aluminum alloys[J]. Chinese Journal of Engineering, 2010, 32(4): 466-471. DOI: 10.13374/j.issn1001-053x.2010.04.010

Cl-对镁-铝合金β相模型合金表面膜稳定性的影响

Influence of Cl- on the stability of surface films on the β phase model alloy of magnesium-aluminum alloys

  • 摘要: 采用电化学阻抗测试技术(EIS)、Mott-Schottky方法对β相模型合金在Cl-溶液环境中形成的表面膜的稳定性和半导体特性进行研究.结果表明,Cl-浓度的增加,使β相表面膜形成和活化溶解的趋势均加剧,即表面膜的稳定性变差.原因在于Cl-浓度较低时,β相表面膜的半导体类型为P型,P型半导体膜是一种阳离子导体膜,Cl-很难通过迁移扩散的方式穿过表面膜.随着Cl-浓度的增大,β相表面膜的半导体类型转变为N型,N型半导体膜便于Cl-穿越膜层到达膜层底部,继续腐蚀金属并使表面膜发生破裂.

     

    Abstract: The stability and semiconductive property of surface films formed on the β phase model alloy were investigated by means of electrochemical impendence spectroscopy(EIS) and Mott-Schottky approach in solutions containing Cl-.The results indicate that the increase of Cl-concentration may accelerate the formation and active dissolution of the films on the surface of β phase,leading to the deterioration of film stability.This phenomenon can be attributed to the fact that the semiconductive type of the films of β phase is P-type in case of solutions with low Cl-concentration.As P-type semiconducting films are cationic conductor films,it is difficult for Cl-to penetrate in a way of transportation and diffusion.When the Cl-concentration increases,the semiconductive type of the films may turn into N-type where Cl-migrates or diffuses in the films,penetrates through the bottom of the films,causes continuous corrosion of the substrate and finally the surface films break down.

     

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