Abstract: Tin-based alloy solder joints are indispensable key part of electronic products and the basis of realizing the functionalization of electronic components. The failure of electronic product is often caused by solder joint damage. Life prediction of the solder joint is of great significance for the reliability research of electronic products. Intermetallic compound (IMC) thickness is an important parameter to evaluate the quality of solder joints. In this paper, the thickness of IMC layer is taken as the key performance degradation parameter, and the solder joints of 62Sn36Pb2Ag QFP device are taken as the research object. The thickness of IMC layer after storage at 94 °C, 120 °C and 150 °C for different time was monitored. Based on Arrhenius equation, the growth kinetics model of intermetallic compound with bilateral interface is established. The failure density function is obtained by fitting the initial IMC thickness with normal distribution, and then the reliability function is obtained to predict the long-term storage failure life of solder joints. These are expected to provide a new way to predict the life of solder joints stored for a long time, and provide experimental and data support for the reliable application of 62Sn36Pb2Ag solder.