周文彧, 夏守余, 陈家骏. Ag-Cu、Ag-H62复合电接点材料界面的原子扩散行为[J]. 工程科学学报, 1988, 10(3): 313-316. DOI: 10.13374/j.issn1001-053x.1988.03.006
引用本文: 周文彧, 夏守余, 陈家骏. Ag-Cu、Ag-H62复合电接点材料界面的原子扩散行为[J]. 工程科学学报, 1988, 10(3): 313-316. DOI: 10.13374/j.issn1001-053x.1988.03.006
Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. DOI: 10.13374/j.issn1001-053x.1988.03.006
Citation: Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. DOI: 10.13374/j.issn1001-053x.1988.03.006

Ag-Cu、Ag-H62复合电接点材料界面的原子扩散行为

Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials

  • 摘要: 用扫描电镜能谱分析半定量和定量测定,经不同热处理工艺的Ag-Cu、Ag-H62冷复合和磁控溅射复合电接点材料界面的成分分布,计算了扩散系数激活能实验表明,材料复合界面是金属键结合。

     

    Abstract: After the Ag-Cu and Ag-H62 electric contact materials arc made by cold press-rolling (or sputtering in magnetic field) and annealed, the quantitative and semi-quantitative analysis are carred out by scanning electron microscope. The results show that the interfaces are of metallic bonding. The diffusion coefficients and the activation energies are also calculated.

     

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