胡茂圃, 王宝珏, 王妹荣, 张文奇. 脉冲化学镀镍磷合金及其性能[J]. 工程科学学报, 1990, 12(2): 109-113. DOI: 10.13374/j.issn1001-053x.1990.02.021
引用本文: 胡茂圃, 王宝珏, 王妹荣, 张文奇. 脉冲化学镀镍磷合金及其性能[J]. 工程科学学报, 1990, 12(2): 109-113. DOI: 10.13374/j.issn1001-053x.1990.02.021
Hu Maopu, Wang Baojue, Wang Meirong, Zhang Wenqi. Pulsed Electroless Nickel-Phosphorus Deposits and Thier Performances[J]. Chinese Journal of Engineering, 1990, 12(2): 109-113. DOI: 10.13374/j.issn1001-053x.1990.02.021
Citation: Hu Maopu, Wang Baojue, Wang Meirong, Zhang Wenqi. Pulsed Electroless Nickel-Phosphorus Deposits and Thier Performances[J]. Chinese Journal of Engineering, 1990, 12(2): 109-113. DOI: 10.13374/j.issn1001-053x.1990.02.021

脉冲化学镀镍磷合金及其性能

Pulsed Electroless Nickel-Phosphorus Deposits and Thier Performances

  • 摘要: 脉冲化学镀是指在化学镀上叠加脉冲电流。本文研究了脉冲电参数(脉冲电流密度与工作比)对镀层的成分、性能和沉积速度的影响。研究结果表明,采用脉冲化学镀可在保持化学镀镍磷合金性能的同时,使沉积速度加快数倍,并发现脉冲电流对自催化的化学沉积镍过程起促进作用。

     

    Abstract: The superposition of pulsed current on the electroless reaction is referred to the pulsed electroless plating. The effects of pulsed parameters (pulsed current desities and duty cycles) and temperatures on the compositions and performances of deposits and the depositing rates are investigated. The results showed that the depositing rates are accelerated by pulsed current without any great loss in the properties of the Ni-P deposit. In addition, the enhancement of the chemical reaction for electroless nickel deposition by pulsed current is found.

     

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