罗泾源, 王明生. Fe-Ni-P非晶合金的电沉积[J]. 工程科学学报, 1990, 12(5): 491-494. DOI: 10.13374/j.issn1001-053x.1990.05.015
引用本文: 罗泾源, 王明生. Fe-Ni-P非晶合金的电沉积[J]. 工程科学学报, 1990, 12(5): 491-494. DOI: 10.13374/j.issn1001-053x.1990.05.015
shu
Luo Jingyuan, Wang Mingsheng. The Electrodeposition of Amorphous FeNiP Alloy Films[J]. Chinese Journal of Engineering, 1990, 12(5): 491-494. DOI: 10.13374/j.issn1001-053x.1990.05.015
Citation: Luo Jingyuan, Wang Mingsheng. The Electrodeposition of Amorphous FeNiP Alloy Films[J]. Chinese Journal of Engineering, 1990, 12(5): 491-494. DOI: 10.13374/j.issn1001-053x.1990.05.015
shu

Fe-Ni-P非晶合金的电沉积

The Electrodeposition of Amorphous FeNiP Alloy Films

    摘要
  • 摘要: 研究了电沉积法制备FeNiP非晶合金的工艺条件。以抗坏血酸作为络合剂,选择了合适的电镀液,研究溶液的pH、温度和电流密度对电镀层的影响。

     

    Abstract: The bright FeNiP alloy film can be electroplated with using the ascorbic acid as the complex compound. Selecting suitable bath solution, the compo sition of alloy film is depended on the technological condition of pH, temperature and cathodic current density.

     

    • HTML全文
    • 参考文献(0)
    • 相关文章
    • 施引文献
  • 资源附件(0)

/

返回文章
返回