胡茂圃, 栾本利. 交流阻抗测定化学镀镍的电化学机理[J]. 工程科学学报, 1991, 13(2): 162-168. DOI: 10.13374/j.issn1001-053x.1991.02.012
引用本文: 胡茂圃, 栾本利. 交流阻抗测定化学镀镍的电化学机理[J]. 工程科学学报, 1991, 13(2): 162-168. DOI: 10.13374/j.issn1001-053x.1991.02.012
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Hu Maopu, Luan Benli. An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements[J]. Chinese Journal of Engineering, 1991, 13(2): 162-168. DOI: 10.13374/j.issn1001-053x.1991.02.012
Citation: Hu Maopu, Luan Benli. An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements[J]. Chinese Journal of Engineering, 1991, 13(2): 162-168. DOI: 10.13374/j.issn1001-053x.1991.02.012
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交流阻抗测定化学镀镍的电化学机理

An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements

    摘要
  • 摘要: 采用交流阻抗技术对化学镀Ni-P合金的沉积过程进行原位测定,所获得的Nyquist阻抗图上出现感抗圈。综合交流抗击以及还原剂浓度影响研究结果,提出一个包括H2PO2-离子表面吸附步骤的化学镀镍电化学机理。

     

    Abstract: The Model 368 system was used to measure the AC impedance of the process of electroless nickel plating. One inductive loop is found at low frequencies. A theoretical model including the step of adsorption of H2PO2- ions is established based on the AC impedance measurements.

     

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