李惠东, 段淑贞, 张新. 用六价铬还原产物电镀铬[J]. 工程科学学报, 1993, 15(6): 614-618. DOI: 10.13374/j.issn1001-053x.1993.06.014
引用本文: 李惠东, 段淑贞, 张新. 用六价铬还原产物电镀铬[J]. 工程科学学报, 1993, 15(6): 614-618. DOI: 10.13374/j.issn1001-053x.1993.06.014
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Li Huidong, Duan Shuzhen, Zhang Xin. Chromium Electroplating Using Reduced Product of Hexavalent Chromium[J]. Chinese Journal of Engineering, 1993, 15(6): 614-618. DOI: 10.13374/j.issn1001-053x.1993.06.014
Citation: Li Huidong, Duan Shuzhen, Zhang Xin. Chromium Electroplating Using Reduced Product of Hexavalent Chromium[J]. Chinese Journal of Engineering, 1993, 15(6): 614-618. DOI: 10.13374/j.issn1001-053x.1993.06.014
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用六价铬还原产物电镀铬

Chromium Electroplating Using Reduced Product of Hexavalent Chromium

    摘要
  • 摘要: 研究了不同还原剂与六价铬的还原反应和各种反应条件对还原率的影响。讨论了反应历程,确定了最佳反应条件。这种还原产物可以做为无毒性电镀铬的铬源。使用这种三价铬化合物进行了电镀试验,获得了厚度超过100μm的镀层。

     

    Abstract: Effects of different reducers as well as various reaction conditions on reducing of hexavalent chromium were investigated. The reaction process was discussed and the optimum reaction conditions were determined. The reaction product can serve as chromium source of nontoxic chromium plating and coating thicker than 100μm was obtained.

     

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