李春元, 王西涛, 袁文霞. Ag-Au-Ge中温钎料的性能[J]. 工程科学学报, 2008, 30(12): 1402-1405. DOI: 10.13374/j.issn1001-053x.2008.12.008
引用本文: 李春元, 王西涛, 袁文霞. Ag-Au-Ge中温钎料的性能[J]. 工程科学学报, 2008, 30(12): 1402-1405. DOI: 10.13374/j.issn1001-053x.2008.12.008
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LI Chunyuan, WANG Xitao, YUAN Wenxia. Properties of Ag-Au-Ge medium temperature solder[J]. Chinese Journal of Engineering, 2008, 30(12): 1402-1405. DOI: 10.13374/j.issn1001-053x.2008.12.008
Citation: LI Chunyuan, WANG Xitao, YUAN Wenxia. Properties of Ag-Au-Ge medium temperature solder[J]. Chinese Journal of Engineering, 2008, 30(12): 1402-1405. DOI: 10.13374/j.issn1001-053x.2008.12.008
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Ag-Au-Ge中温钎料的性能

Properties of Ag-Au-Ge medium temperature solder

    摘要
  • 摘要: 通过分析Ag-Au-Ge体系三元相图,根据其存在的共晶单变线e1e2,制备了两种接近共晶成分的Ag-Au-Ge钎料合金(AAG1和AAG2),研究了钎料合金的熔点、润湿性等性能,观察了合金的显微组织以及合金与Al-SiC/Ni/Au基板的结合界面.实验结果显示:AAG1合金的固相线和液相线的温度分别为410.0和449.8℃,AAG2相应的温度为401.1和441.0℃;两种钎料合金的固液相间距较大.AAG1对基板的润湿性较好;两种合金与基板的接触性很好,界面没有发现金属间化合物.AAG1可以作为400~500℃的钎焊料使用.

     

    Abstract: Two eutectic alloys, AAG1 and AAG2, were selected as solder according to the Ag-Au-Ge ternary phase diagram. The solder alloys were prepared by vacuum melting. The melting point, wettability, microstructure of the solder alloys and the interface between solder and Al-SiC/Ni/Au substrate were investigated. The results show that these two solder alloys have large temperature gap between solidus and liquidus. The temperature of solidus and liquidus are 410.0℃; and 449.8℃ for AAG1 and 401.1℃ and 441.0℃ for AAG2, respectively. The alloy AAG1 has good wettability to the substrate. Both two solder alloys have good adhesion with the substrate. No intermetallic phase was found at the interface. It is concluded that the alloy AAG1 could be possibly used as the solder for 400-500℃.

     

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