徐彬, 李小辉, 童晓静, 牛振江, 冷文华, 张鉴清. 多孔SnO2-Cu2O复合薄膜的制备及其光催化性能[J]. 工程科学学报, 2010, 32(12): 1580-1585. DOI: 10.13374/j.issn1001-053x.2010.12.011
引用本文: 徐彬, 李小辉, 童晓静, 牛振江, 冷文华, 张鉴清. 多孔SnO2-Cu2O复合薄膜的制备及其光催化性能[J]. 工程科学学报, 2010, 32(12): 1580-1585. DOI: 10.13374/j.issn1001-053x.2010.12.011
XU Bin, LI Xiao-hui, TONG Xiao-jing, NIU Zhen-jiang, LENG Wen-hua, ZHANG Jian-qing. Preparation and photocatalytic activity of coupled SnO2-Cu2O porous films[J]. Chinese Journal of Engineering, 2010, 32(12): 1580-1585. DOI: 10.13374/j.issn1001-053x.2010.12.011
Citation: XU Bin, LI Xiao-hui, TONG Xiao-jing, NIU Zhen-jiang, LENG Wen-hua, ZHANG Jian-qing. Preparation and photocatalytic activity of coupled SnO2-Cu2O porous films[J]. Chinese Journal of Engineering, 2010, 32(12): 1580-1585. DOI: 10.13374/j.issn1001-053x.2010.12.011

多孔SnO2-Cu2O复合薄膜的制备及其光催化性能

Preparation and photocatalytic activity of coupled SnO2-Cu2O porous films

  • 摘要: 采用加热氧化多孔Sn-Cu合金电沉积层,制备得多孔SnO2-Cu2O复合薄膜.应用X射线衍射(XRD)、扫描电子显微镜(SEM)和X射线能量散射(EDS)分析了镀液中Sn2+/Cu2+值对薄膜结构、形貌和组成的影响.通过低压汞灯下光降解罗丹明B的反应测试了薄膜的光催化活性.结果表明,从0.01mol·L-1 CuSO4、0.05mol·L-1 SnSO4、1.5mol·L-1 H2SO4、7mL·L-1甲醛和0.001%聚乙二醇辛基苯基醚(OP)的镀液中,在20℃以6.0 A·cm-2的电流密度沉积得到的Sn-Cu合金,经过在空气气氛下200℃,2h和400℃,2h加热氧化后,转变为Sn/Cu值为3∶1的SnO2-Cu2O复合薄膜,显示出优异的光催化降解罗丹明B的活性,这归因于薄膜具有三维多孔的形貌和适合的Sn/Cu比.

     

    Abstract: Porous SnO2-Cu2O composite films were prepared through thermal oxidation of porous Sn-Cu alloy electrodeposits in air.The effects of the Sn2+/Cu2+ molar ratio of solutions on the morphologies, constituents and structures of coupled SnO2-Cu2O porous films were investigated by scanning electron microscopy(SEM), energy dispersive X-ray spectroscopy(EDS) and X-ray diffraction(XRD) analysis.And the photocatalytic activity of the films was tested by photodegradation of rhodamine B under irradiation of a low-pressure mercury lamp.The results indicate that a coupled SnO2-Cu2O porous film with a Sn∶Cu ratio of 3∶1 has the best photocatalytic activity for degradation of rhodamine B.The film was prepared by electrodepositing a Sn-Cu alloy in a solution containing 0.01 mol·L-1 CuSO4, 0.05 mol·L-1 SnSO4, 1.5 mol·L-1 H2SO4, 7 mL·L-1 formaldehyde and 0.001% polyethyleneglycol octyl phenyl ether(OP) at 6.0 A·cm-2 and 20 ℃, then heating the Sn-Cu alloy at 200 ℃ for 2 h followed by 400 ℃ for 2 h in air.The reason for a higher photocatalytic activity of the film may be its three-dimensional porous morphology and proper Sn/Cu ratio.

     

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