Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. DOI: 10.13374/j.issn1001-053x.1988.03.006
Citation:
Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. DOI: 10.13374/j.issn1001-053x.1988.03.006
Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. DOI: 10.13374/j.issn1001-053x.1988.03.006
Citation:
Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. DOI: 10.13374/j.issn1001-053x.1988.03.006
Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials
After the Ag-Cu and Ag-H62 electric contact materials arc made by cold press-rolling (or sputtering in magnetic field) and annealed, the quantitative and semi-quantitative analysis are carred out by scanning electron microscope. The results show that the interfaces are of metallic bonding. The diffusion coefficients and the activation energies are also calculated.
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