Investigation On Microstructure of YA-TZP and Its Application for Wire Drawing Dies
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Abstract
The properties of YA-TZP depend on its microstructures. Optimal combination of mechanical properties with σb =940~1010 MPa and K1c=10.9 MPa√m was obtained as the critical grain size~0,7μm. No strength degradation after aging at 250℃ for 50h. The morphology of different phases in ZrO2, the microcracks and particles of secondary phase wereinvestigated and dislocation networks and lines were found under TEM. Pre-liminary tests show good prospect on application for wire drawing dies.
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