Ge Changchun, Xia Yuanluo, Liu Guangzu. Investigation On Microstructure of YA-TZP and Its Application for Wire Drawing Dies[J]. Chinese Journal of Engineering, 1991, 13(S2): 61-64. DOI: 10.13374/j.issn1001-053x.1991.s2.011
Citation: Ge Changchun, Xia Yuanluo, Liu Guangzu. Investigation On Microstructure of YA-TZP and Its Application for Wire Drawing Dies[J]. Chinese Journal of Engineering, 1991, 13(S2): 61-64. DOI: 10.13374/j.issn1001-053x.1991.s2.011

Investigation On Microstructure of YA-TZP and Its Application for Wire Drawing Dies

  • The properties of YA-TZP depend on its microstructures. Optimal combination of mechanical properties with σb =940~1010 MPa and K1c=10.9 MPa√m was obtained as the critical grain size~0,7μm. No strength degradation after aging at 250℃ for 50h. The morphology of different phases in ZrO2, the microcracks and particles of secondary phase wereinvestigated and dislocation networks and lines were found under TEM. Pre-liminary tests show good prospect on application for wire drawing dies.
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