Huang Jihua, Qian Yiyu, Jiang Yihong, Pei Jiaying. The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling[J]. Chinese Journal of Engineering, 1993, 15(3): 293-297. DOI: 10.13374/j.issn1001-053x.1993.03.028
Citation: Huang Jihua, Qian Yiyu, Jiang Yihong, Pei Jiaying. The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling[J]. Chinese Journal of Engineering, 1993, 15(3): 293-297. DOI: 10.13374/j.issn1001-053x.1993.03.028
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The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling

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    • Abstract
  • An experimental setup and a simulated ceramic chip carrier for study of the SMT solder joint reliability under thermal cycling have been developed. The influence of metal plating of chip carrier on the reliability of the SMT solder joints under thermal cycling has been studied statistically.
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