Li Xuetong, Wang Youming, Xu Jianguo, Xue Guijun. Quenching-tempering Process Effect on Microstructure and Properties of 590 MPa High Strength Thick Plate[J]. Chinese Journal of Engineering, 1998, 20(3): 273-276. DOI: 10.13374/j.issn1001-053x.1998.03.036
Citation: Li Xuetong, Wang Youming, Xu Jianguo, Xue Guijun. Quenching-tempering Process Effect on Microstructure and Properties of 590 MPa High Strength Thick Plate[J]. Chinese Journal of Engineering, 1998, 20(3): 273-276. DOI: 10.13374/j.issn1001-053x.1998.03.036
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Quenching-tempering Process Effect on Microstructure and Properties of 590 MPa High Strength Thick Plate

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  • A new quenching-tempering technology system is gotten, in which the quenching temperature is about 910~920℃ and the tempering temperature is about 550~580℃. With using this technology, the mechanical properties of the 590 MPa high strength thick plate are better satisfaction for the using demand. The new technology system is available for the steel plate of different composition.
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