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HUANG Tianbin, LIU Jingming, TANG Weizhong, TONG Yumei, YU Wenxiu, LU Fanxiu. Thermal Stress Analysis of Large Area Diamond Films[J]. Chinese Journal of Engineering, 2000, 22(2): 153-155. DOI: 10.13374/j.issn1001-053x.2000.02.016
Citation: HUANG Tianbin, LIU Jingming, TANG Weizhong, TONG Yumei, YU Wenxiu, LU Fanxiu. Thermal Stress Analysis of Large Area Diamond Films[J]. Chinese Journal of Engineering, 2000, 22(2): 153-155. DOI: 10.13374/j.issn1001-053x.2000.02.016
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Thermal Stress Analysis of Large Area Diamond Films

  • Materials Science and Engineering School, UST Beijing, Beijing 100083, China

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  • Received Date: January 11, 1999
  • Available Online: August 26, 2021
    Graphical Abstract
    • Abstract
  • The distribution of the thermal stress of large area diamond films is given by applying the actual boundary condition, and it is checked by experiments. The result is that the thermal stress of large area diamond films is not uniform, the thermal stress in the middle of large area diamond films is lager than that in the edge of large area diamond films, the press stress is the mainly part of the thermal stress. The crack of diamond films is mainly duo to the large press stress.
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