WANG Zidong, LIU Xing, WANG Guiqing, WU Chunjing, XIE Jianxin, WENG Min. Microstructure and Defect of Cu-Cr Alloy during Continuous Unidirectional Solidification[J]. Chinese Journal of Engineering, 2000, 22(6): 543-546. DOI: 10.13374/j.issn1001-053x.2000.06.015
Citation: WANG Zidong, LIU Xing, WANG Guiqing, WU Chunjing, XIE Jianxin, WENG Min. Microstructure and Defect of Cu-Cr Alloy during Continuous Unidirectional Solidification[J]. Chinese Journal of Engineering, 2000, 22(6): 543-546. DOI: 10.13374/j.issn1001-053x.2000.06.015

Microstructure and Defect of Cu-Cr Alloy during Continuous Unidirectional Solidification

  • The match relationship among technological conditions of Cu-Cr alloy, during continuous unidirectional solidification has been studied. Microstructure of Cu-Cr alloy and the reason for formation of surface defect in Cu-Cr alloy have been analyzed. The best technological conditions are:height of mold is 10-25 mm, cooling distance is 25 mm, melting temperature of Cu-Cr alloy is 1 280℃, Withdrawal speed is 0.24-1.00 mm/s, amount of cooling water is 720 L/h.
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