LI Hongying, OU Ling, ZHANG Jianfei, CHEN Jun, ZHENG Ziqiao. Flow stress of a new type Al-Cu-Li system alloy during hot compression deformation[J]. Chinese Journal of Engineering, 2006, 28(8): 750-754. DOI: 10.13374/j.issn1001-053x.2006.08.009
Citation: LI Hongying, OU Ling, ZHANG Jianfei, CHEN Jun, ZHENG Ziqiao. Flow stress of a new type Al-Cu-Li system alloy during hot compression deformation[J]. Chinese Journal of Engineering, 2006, 28(8): 750-754. DOI: 10.13374/j.issn1001-053x.2006.08.009

Flow stress of a new type Al-Cu-Li system alloy during hot compression deformation

  • The flow stress behavior of a new type Al-Cu-Li system alloy during hot compression deformation was studied in the strain rate range from 0.01 to 10 s-1 and the temperature range from 300 to 500℃ by isothermal compression test on a Gleeble 1500 thermal-mechanical simulator. The results show that the flow stress of this new type Al-Cu-Li system alloy decreases with the increase of deformation temperature and increases with the increase of strain rate. The peak flow stress during high temperature deformation can be represented by Z parameter in a hyperbolic sine function. The analytical expression of peak flow stress was fitted with the hot deformation activation energy of 239.02 kJ·mol-1.
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