XUE Qing-guo, SUN Wei, WANG Jing-song, CAO Li-jun, SUN Hao-yan, WANG Jing-hua. Effect of electro-pulse modification on the growth kinetics of hot dip galvanizing[J]. Chinese Journal of Engineering, 2012, 34(7): 783-787. DOI: 10.13374/j.issn1001-053x.2012.07.010
Citation: XUE Qing-guo, SUN Wei, WANG Jing-song, CAO Li-jun, SUN Hao-yan, WANG Jing-hua. Effect of electro-pulse modification on the growth kinetics of hot dip galvanizing[J]. Chinese Journal of Engineering, 2012, 34(7): 783-787. DOI: 10.13374/j.issn1001-053x.2012.07.010

Effect of electro-pulse modification on the growth kinetics of hot dip galvanizing

  • The influence of electro-pulse modification on the growth kinetics of hot-dip galvanizing coatings was studied through an orthogonal test method. The time exponent of growth rate was taken as an evaluation index to optimize the treatment effect of electropulse modification. Orthogonal experiment results show that pulse capacitance has the most significant influence on the growth of the alloy layer, but the influence of treating time is little. The effect of electro-pulse modification would be better in the condition of the capacitance of 200 μF, the voltage of 700 V, the pulse frequency of 2 Hz, and the treating time of 30 s. Hot-dip galvanizing experimental results at these optimum parameters show that the growth of the alloy layer is inhibited, the coating thickness is decreased, and the structure is more dense and uniform. The time exponent of growth rate decreases from 0.717 to 0.428. The growth pattern of the alloy layer transforms from integrated control by interface reaction and diffusion to independent control by diffusion.
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